Used SAMSUNG TECHWIN SRF30124NS #9298753 for sale

SAMSUNG TECHWIN SRF30124NS is a state-of-the-art pressure bonder that combines the latest technology and smart design to provide an efficient, user-friendly, and reliable solution for reliable, precision bonding. This bonder is a fully automatic peripheral bonder with a smart control equipment, making it ideal for large-scale production of optoelectronic products. SRF30124NS features a two-phase bonding process, including preheating and bonding, which provides users with consistent results and a fast cycle time. The unit offers a chamber temperature range of 0 to 200°C and a pressure range of 0.5 to 60N/mm. The user-friendly control system features a bright LCD display, providing a simple interface for setting and controlling the bonding process. The bonder is compatible with a wide range of bond materials, and can handle adhesive, solder paste, pre-applied conductive adhesive, and flux in combination with silver, gold, and aluminum materials. The intelligent pressure control prevents rapid cooling or heat fluctuation during the bonding process, resulting in excellent bonding results. SAMSUNG TECHWIN SRF30124NS is also equipped with a speedy and accurate process control algorithm, and its automatic precision alignment unit ensures higher repeatability and accuracy for all bonding operations. The presser the bonder features makes sure that the bonds are even and strong, eliminating any possibilities for inferior bonds caused by uneven pressure. The bonder is designed for safe and reliable operation, with its over-temperature protection, bonding chamber cooling, temperature detection, and fault alarm machine all ensuring maximum user safety. SRF30124NS also offers a wide range of optional features, such as a quick release function, programmable start/stop button, and mass flow controller for precise control of flux. SAMSUNG TECHWIN SRF30124NS is an advanced and reliable bonder, combining the latest technology and smart design to provide excellent and consistent bonding. Its user-friendly control tool makes operation simple and its wide range of compatible bond materials makes it a versatile solution for all your bonding needs. It is an exceptional choice for any optoelectronic production line.