Used SEMES AWH-8000 #9298801 for sale

SEMES AWH-8000 Bonding Machine is a advanced solution for automating the process of bonding semiconductor devices. This machine has been designed specifically to meet the high demand in the electronic component industry for bonding devices. The main advantages of using AWH-8000 Bonding Machine are its high speed and precision. As opposed to manual operations, this machine has advanced algorithms and features that ensure the best possible accuracy and speed of each process. SEMES AWH-8000 has an optimized automated equipment for chip picking, chip alignment, thermocompression soldering, and trimming. The main components of the machine include: platform conveyor, component pick-up system, chip alignment unit, thermocompression soldering unit, and trimming tools. The conveyor platform runs flat on the entire machine and is used to deliver components to the pick-up machine. The chip pick-up tool accurately and efficiently places chips onto the chip alignment asset using precise positioning. The chip alignment model includes x, y, and z-alignment components to ensure the chips are correctly placed. Once the chips have been accurately placed, the thermocompression soldering unit applies pressure and heat to create a secure connection between the chip and PCB. The trimming tools are used to precisely cut the excess components away. The entire bonding process is repeatable and accurate, providing optimum yield every time. AWH-8000 offers increase production rates as well as minimized costs through the use of advanced software and hardware. SEMES AWH-8000 Bonding Machine takes full advantage of modern technology and allows operators to set up and run the machine with minimal effort. This reliable and efficient automated bonder makes it an ideal choice for industries looking to streamline their production process with limited resources. AWH-8000 has also been recognized in the industry for its reliability and performance due to the use of advanced algorithms and features.