Used SEMICONDUCTOR EQUIPMENT CORP 830 #9176282 for sale

SEMICONDUCTOR EQUIPMENT CORP 830 bonder is a multi-purpose, high-precision, heavy-duty bonder that provides reliable and accurate bonding of materials used in the fabrication of semiconductor devices. This heavy-duty bonder has a variable speed, bidirectional, digitally-controlled drive that is designed to optimise bonding time and cycle time. It features an 11-station rotary feeder which accommodates both manual and automatic palletized wafers and small parts. 830 bonder's two power-regulated hot plates can handle up to 10 Kg of materials each and its working area is 215x190mm. It also has four pneumatic nozzles with heated inner nozzle surfaces and heated exhaust nozzles. This equipment is equipped with a PC-based workstation, with an integrated software package allowing easy set up, storage and retrieval, and control of recipes. SEMICONDUCTOR EQUIPMENT CORP 830 bonder uses a cooled non-oxidizing glass pool platen for easy cleaning and precise foil pick-ups. Included in the system are two high-precision, four-jaw, two-axis micro-positioners, allowing for accurate alignment and repeatability of bonded parts. 830 bonder is easy to use, allowing even less experienced operators to achieve high-precision bonding with a minimum of setup time. Furthermore, the system features a temperature control unit with temperature range cycling and an array of sensors for the measurement of temperature, force, vacuum and time. SEMICONDUCTOR EQUIPMENT CORP 830 bonder can easily accommodate a variety of jobs, ranging from simple aluminum bonds to more difficult alloy bonding. The system's temperature and pressure can be adjusted for specific applications, enabling delicate and reliable bonds. Additionally, 830 bonder is highly automated, making it exceptionally cost effective and time efficient for high-volume production.