Used SEMICONDUCTOR EQUIPMENT CORP / SEC 860 #293618801 for sale

SEMICONDUCTOR EQUIPMENT CORP / SEC 860 is a dedicated three-dimensional, fully automatic bonder. This equipment is designed and manufactured primarily for semiconductor users and assembly. It is an essential tool in achieving higher production throughput by providing a reliable, repeatable, non-contact bonder. SEC 860 can provide bonding of IC's, MLCC's and other fine pitch devices without manual operation or any other wet preparation steps. This aids in reducing cycle times and ensuring precise bond locations and accurate contact. Implementation time is drastically cut because SEMICONDUCTOR EQUIPMENT CORP 860 has a minimal footprint, this also reduces floor space. The bonder is user-friendly and employs a convenient graphical user interface (GUI) for ease of operation. In terms of features, 860 includes a vision-guided motorized auto-alignment. This ensures minimal cycle times and precise alignment of bonding tips. It also implements an auto-feeder system for easy loading and unloading of wafers with immediate access to wafer edges. This feature is of great benefit to production lines as it eliminates the need for manual handling, and increases the reliability of the bond positioning. SEMICONDUCTOR EQUIPMENT CORP / SEC 860 is highly reliable, robust and repeatable. It has higher positional accuracy than all of its competitors. The precision 3D stage has low residual stages errors providing reliable non-contact bonding, along with a quality control system. The wafer clamp secures tightly to the wafer, eliminating slippage and inaccuracy, while the precisely designed thermal head processes through the wafer efficiently with high yields and repeatability. Split heated pouching in different chambers allow maximum process flexibility and throughput. SEC 860 is ideal for today's IC assembly production lines and is the latest innovation in bonder technology. Its improved and reliable performance, user-friendly GUI, 3D Motion Control, high positional accuracy and efficient thermal head make it the perfect choice for all IC assembly tasks.