Used SEMICONDUCTOR EQUIPMENT CORP / SEC 860 #293814330 for sale

SEMICONDUCTOR EQUIPMENT CORP / SEC 860 is a state-of-the-art bonding machine designed for the needs of semiconductor manufacturers. SEC 860 features a four-station operation, with each station providing a unique and essential element of the bonding process. Station one utilizes a controlled plasma atmosphere to clean and etch the surfaces of the substrates to be bonded. This station provides a consistent, repeatable cleaning process across a wide range of substrates, and ensures a clean and secure bonding surface. The second station involves heating the substrates to prepare them for bonding. This step of the process requires precise temperature control, which SEMICONDUCTOR EQUIPMENT CORP 860 provides with a digitally-controlled heat system. This ensures that the required substrate temperature is maintained, while also offering adjustable parameters for multiple configurations. The third station is the actual bonder station, and is where the substrates are placed together and bonded. 860 utilizes Ultrasonic assimilation for bonding, which ensures a secure bond each and every time. The results achieved with Ultrasonic assimilation are much higher than those achieved with traditional or "hot soldering" techniques. Finally, station four provides a controlled cool-down of the bonded substrates after the bond has been formed. Again, SEMICONDUCTOR EQUIPMENT CORP / SEC 860 contains a digitally-controlled heat system to ensure the substrates are cooled off quickly, and to ensure that the bond does not become weakened over time. Overall, SEC 860 is a highly efficient and sophisticated bonding machine. Its four-station operation ensures a consistent, repeatable bonding process across a wide range of substrates, while its digitally-controlled heat system allows for precise temperature control and cooling. As a result, SEMICONDUCTOR EQUIPMENT CORP 860 offers the high quality bond demands of modern day semiconductor manufacturers.