Used SEMICONDUCTOR EQUIPMENT CORP / SEC 860 #9085398 for sale

SEMICONDUCTOR EQUIPMENT CORP / SEC 860 is a semi-automated bonder that is designed to address the manufacturing requirements of semiconductor device manufacturers. The bonder is capable of bonding a variety of devices such as capacitor arrays, resistor networks, transistor arrays, and other similar materials. The bonder has a chassis constructed of steel with the appropriate protections for durability and environmental variables. SEC 860 is driven by an LCD control panel that provides a visual interface for user operation. This panel is designed to support a variety of parameter settings to cater to the different processing requirements of production lines. The parameter settings include programming and editing of individual steps, offsets, lead frames, and other variables. To ensure consistent performance and reduce operational mistakes, the control panel includes automatically enabled functions like parameter self-testing, real-time data logging, diagnosis, and record keeping. SEMICONDUCTOR EQUIPMENT CORP 860 has two main equipment components — a manipulator arm and a workhead. The manipulator arm is equipped with two 3-axis actuators which provide the capability for processes such as adjusting material forces, positioning elements, and calibration operations. On the other hand, the workhead includes two standard bonding tools to provide high quality outputs. The tools can be programmed for the trimming and forming operations, as needed. The automated functions of 860 are powered by a Windows XP-based integrated controller. It operates with a specialized power supply that consists of 8 GB RAM, an Intel ® Core2 processor, and a storage of up to 500 GB in an SSD configuration. For material production and monitoring, the bonder is integrated with the company's proprietary, cross-platform software application. SEMICONDUCTOR EQUIPMENT CORP / SEC 860 also features intuitive safety features that help to reduce downtime and maximize productivity. It is designed with safety alarms and sensors that protect both the device and the operator from any physical injury. The bonder is also equipped with a device monitoring system to constantly check the operation of the equipment to avoid production failures. Overall, SEC 860 is an ideal solution for semiconductor device manufacturers. It is capable of bonding many different materials, and is powered by an intuitive and powerful integrated controller. The bonder also includes safety features that protect both the user and the device from any harm.