Used SEMICONDUCTOR EQUIPMENT CORP / SEC 860 #9242628 for sale

SEMICONDUCTOR EQUIPMENT CORP / SEC 860 is a high-performance bonder that has been specifically designed for assembling microelectronic components. Its features are suitable for complex and delicate operations in the growth, assembly and packaging of semiconductor devices. This bonder features a multi-position field flattening stage which provides smooth and uniform bonding around the whole surface and evenly-distributed force to ensure a smooth and reliable micro-bond. Moreover, its integrated Vacuum/GO/NO-GO Probe provides efficient, repeatable and reliable bond verification. With an intuitive user interface suggested by PC/DOS operating system, SEC 860 provides a pleasant user experience while allowing full configuration of bond speed, force, preheat, and dwell time, all available via the front panel control. Its internal logic storer accommodates up to 250 bond recipes for maximum optimization. Moreover, this bonder is equipped with a high-speed digital servo motor and closed-loop system that allows extremely precise control. The software provides convenient data management which allows easy archive and restore of bond data as well as full flexibility to create custom bond programs. Securely mounted on a rigid and durable base, SEMICONDUCTOR EQUIPMENT CORP 860 bonder is also equipped with a robust C-frame construction for superior stability and uniform bond strength. It contains a durable Z motor for precise indexing of the field flattening stage, and a 24 VDC ionizer for safe and efficient ground to dissipate static and floating charges. 860 bonder also features a fully adjustable stop position to eliminate manual adjustment for respective operations while greatly reducing downtime and increasing efficiency. It is constructed out of durable materials and has an IP52 protection level rating, meaning it is resistant to dust and splashes of water or liquids. In conclusion, SEMICONDUCTOR EQUIPMENT CORP / SEC 860 bonder has the capacity to meet the needs of even the most delicate microelectronic components while providing unparalleled speed and accuracy. Its intuitive user interface, high-quality components, and robust construction make it an invaluable tool for any microelectronic device manufacturer.