Used SET / KARL SUSS FC 300 #9267462 for sale
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ID: 9267462
Vintage: 2014
Flip chip bonder
Size: 0.5 mm x 1.0 mm to 10 mm x 15 mm
Includes:
Laser-leveling
Bond head
Stage
Control cabinet
Chiller
Transformer
Vacuum pump
Maximum force: 4,000N
Auto-collimator
Heaters for chuck and arm
Chuck, 12" (300 mm)
Arm, sq. 50 mm
2014 vintage.
SET / KARL SUSS FC 300 bonder is a highly advanced and versatile bonding equipment that is designed for various bonding applications in the semiconductor industry. It provides precise control and automation capabilities for bonding processes, making it suitable for both research and production environments. SET FC 300 boasts a range of features and functionalities that enhance bonding accuracy, repeatability, and efficiency. One of the key features of KARL SUSS FC 300 bonder is its advanced alignment capabilities. The system is equipped with high-resolution optical alignment systems that enable precise alignment of substrates and components before bonding. This ensures accurate placement and bonding of delicate microelectronic components, such as chips, wafers, and sensors. The alignment systems can compensate for misalignment errors and optimize the bonding process for high yield and reliability. FC 300 bonder also offers multiple bonding technologies to accommodate different bonding requirements. It supports various bonding techniques, including thermo-compression bonding, ultrasonic bonding, and eutectic bonding. This flexibility allows users to choose the most suitable bonding method for their specific applications, such as wire bonding, die bonding, and MEMS packaging. The unit can be easily configured to switch between bonding modes, making it a versatile solution for diverse bonding needs. In terms of automation and control, SET / KARL SUSS FC 300 bonder is equipped with advanced software and hardware components that enable precise process control and monitoring. The machine features a user-friendly interface that allows operators to SET up bonding parameters, monitor process variables, and analyze bonding results in real-time. The software also includes advanced algorithms for optimizing bonding parameters, such as bonding force, temperature, and time, to achieve optimal bonding quality and productivity. Furthermore, SET FC 300 bonder is built with a robust and stable platform that ensures reliable and consistent bonding performance. The tool is constructed with high-quality materials and components that can withstand the rigors of semiconductor manufacturing environments. It is designed for long-term operation with minimal maintenance requirements, reducing downtime and operational costs for users. KARL SUSS FC 300 bonder also incorporates safety features and mechanisms to protect operators and prevent damage to sensitive components during the bonding process. For research and development applications, FC 300 bonder offers flexibility and scalability to adapt to evolving bonding requirements. The asset can be customized with additional modules and accessories, such as wafer chuck adapters, bonding heads, and process monitoring tools, to expand its capabilities and accommodate new bonding processes. This scalability makes SET / KARL SUSS FC 300 bonder a future-proof investment for research labs and semiconductor facilities that need to stay ahead of technological advancements in the industry. Overall, SET FC 300 bonder is a cutting-edge bonding model that combines precision, versatility, and reliability to meet the demanding requirements of semiconductor bonding applications. With its advanced alignment systems, multiple bonding technologies, automation capabilities, and robust design, KARL SUSS FC 300 bonder sets a new standard for bonding equipment in the semiconductor industry. Users can benefit from improved bonding quality, efficiency, and productivity with FC 300 bonder, making it an indispensable tool for semiconductor manufacturers, research institutions, and microelectronics companies.
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