Used SHENZHEN DB-8080V #9315687 for sale

SHENZHEN DB-8080V bonder is a lightweight, cost-effective, high-speed bonding solution that offers superior performance in a variety of applications. This industry-leading bonder is designed for processing precise parts with extreme repeatability and reliability. It's ideal for creating microelectronic assemblies, such as capacitors, transistors, diodes, and integrated circuits for commercial and military applications. DB-8080V enables users to bond a wide variety of parts over a wide range of temperatures, giving users versatility and reliability for their bonding projects. It delivers high-resolution thermal welding and down-pressure bonding with great precision and repeatability. The bonder also has an extensive library of high and low-temperature bonding programs and profiles that can be tweaked easily for custom applications. SHENZHEN DB-8080V features quick evacuation times, enabling users to quickly evacuate the system to reduce the cycle time. It also helps in maximizing throughput with its simultaneous evacuation and bonding capabilities. The bonder is also equipped with a 15" LCD multi-touch screen, allowing users to control the system with ease while monitoring the bonding process in real-time. To further maximize performance, users can connect the bonder to an automated fixture for repeatable process and verification. DB-8080V has impressive energy-efficiency and requires minimal maintenance with its simple design. The efficient thermal welding and down-pressure program can help in reducing operating costs, adding to its economical capabilities. The extensive thermal welding library also makes it easy to program parts with different characteristics and reduces training costs for new personnel. SHENZHEN DB-8080V is an outstanding bonder for applications requiring extremely precise parts with repeatability and reliability. With its wide range of parameters and user-friendly interface, users can easily program and keep track of their work without any fuss. It's ideal for creating microelectronic applications and assemblies, making it the perfect bonder for any industry.