Used SHIBUYA DB 250 #293651876 for sale

Manufacturer
SHIBUYA
Model
DB 250
ID: 293651876
Vintage: 2011
Flip chip bonder 2011 vintage.
SHIBUYA DB 250 is a high-performance bonder developed by SHIBUYA Denki Seisakusho. It is designed for high-end microelectronic packaging needs and offers an excellent level of performance in wire-bonding applications. It can be used in both manual and automatic production environments. The binder combines a large memory capacity, an onboard HDD, and powerful machine programming software to allow high-volume productions at a low cost. Its advanced design incorporates a high-speed wire-bonding coil control, low-force feed system and an easy-to-operate joystick for precise wire positioning and high accuracy. This binder is also equipped with an independent X and Y axis servo drives that provide high precision operation. The drive enables quick wire feed movement and ensures smooth wire positioning. The binder's open frame design features a base plate made of high-resistance aluminum alloy, which provides good performance and durability. Other features include an integrated welder that allows users to securely bond wires with a low-force setting. The binder can also be used with a wide range of dies, which minimizes the need for maintenance and retooling. DB 250 has an industrial design with a small footprint and is suitable for use in high-volume manufacturing processes. It boasts a low cost per chip and a low overhead cost for operation. The binder also offers a low-cost solution for full traceability and traceability solutions. The binder's compact design allows it to be used in confined spaces, such as small production floors. Its onboard data logging and reporting system allow for improved production monitoring and optimization. Finally, the binder can be connected to a computer and is supported by a range of software options.
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