Used SHIBUYA SDM-200C #293662322 for sale

SHIBUYA SDM-200C is a high-tech wire and ribbon bonder designed to streamline the bonding process for production in the electronics industry. The equipment supports both thermosonic and thermocompression wire bonding as well as overmolded gold ribbon bonding, offering outstanding reliability and versatility at an exceptional price. SDM-200C's user-friendly software interface allows operators of any skill level to accurately setup and operate the bonder quickly and easily. The bond head's integrated straight line motion system allows for greater accuracy and repeatability than conventional wire bonders, resulting in fewer rejections due to misalignment and other common errors. To further ensure high quality bonding, the unit is equipped with a unique PZT scanning Z-axis, which allows for high-precision bonding of multiple layers on the same device. The bonder's advanced features also include state-of-the-art process monitoring, which enables it to adjust parameters on the fly in order to maintain quality and production speed. The machine is further equipped with several process-assuring capabilities, such as a high-quality imaging machine, force and displacement monitoring, and load control capabilities. In addition to being cost-effective, SHIBUYA SDM-200C offers low maintenance requirements, thanks to its advanced self-diagnosing tool. The asset is also designed for maximum efficiency, with its user- friendly data entry, integrated work logs, and automated production sequence capability. Finally, SDM-200C is designed to accommodate both short- and long-term runs. The model can be configured to automatically change bonding settings for different batches, enabling efficient production of multiple different bond types for large orders. Overall, SHIBUYA SDM-200C is an ideal wire and ribbon bonder for production in the electronics industry. The machine's advanced features, cost-effectiveness, and user-friendly controls make it a great choice for any application.