Used SHIBUYA SDM 250 #130963 for sale

SHIBUYA SDM 250 is a high-precision and multi-functional Diamond Bonder developed by SHIBUYA Corporation and released in 2021. This equipment consists of 3-axis Bond Arm, Bond Head, and Chiller, providing precision and durability, as well as a variety of features to support successful diamond bonding and die-attaching processes. The most critical aspect of any diamond bonding or die-attaching operation is the accuracy of the bond position. The Bond Arm and Bond Head of SDM 250 are both designed to deliver a highly accurate bond positioning of 0.5µm or better, with a total vibration-free movement of 8mm. This enables operators to produce high-precision bonds for their application needs. The Bond Head consists of the main drive mechanism, bonding head assembly, and CCD camera to ensure excellent precision. SHIBUYA SDM 250 also features a unique Z-axis drive system with dynamic touch-sensing control to detect the substrate surface, providing an even higher level of accuracy than previous systems. Furthermore, SDM 250 features a high-precision control unit to prevent thermal drift and optimize temperature control, as well as an advanced air pressure control machine to ensure the ideal bonding condition. It also includes a modified Monolithic Bond Head, which is designed to minimize the effect of thermal shocks on the bond head and its components. SHIBUYA SDM 250 also includes several convenient features to make it the ideal choice for users. It has a multi-language interface and Library functions for users to load, record, edit, and create diamond bonding programs, as well as an integrated Simulator for testing and verifying the accuracy of new program data before actual bonding operations. SDM 250 is also designed for ease-of-use and reliability. Its dust-proof and dust-resistant body is complemented by a unique vibration-dampening design, providing quiet operation while avoiding the potential of contamination. Finally, SHIBUYA SDM 250 features a durable and reliable construction and component selection, allowing it to go beyond diamond bonding and die-attaching applications. It is capable of a wide range of sealing and packaging operations, ranging from die bonding with leaded and lead-free components, wire bonding with heat resistors and laser-welded copper wire, and seal-sealing techniques with fluxless anisotropic conductive pastes (ACP). Overall, SDM 250 provides operators with a reliable and cost-effective solution for precision diamond bonding and die-attaching operations. With its reinforced component selection, precision control, and user-friendly features, SHIBUYA SDM 250 is an ideal choice for any industrial diamond bonding application.