Used SHINKAWA ACB-3000 #293706238 for sale

SHINKAWA ACB-3000 is a premium microchip bonding and assembly tool used to connect microchips to circuit boards and substrates. This bonder ships with high specifications and features designed to maximize reliability and efficiency. SHINKAWA ACB 3000 offers improved precision and accuracy, with a scalable bonding accuracy of +/-1.5 micrometers. This precision is made possible by its advanced vision system, consisting of a high-resolution camera and an integrated scanning microscope, which enables the bonder to more accurately track and adjust its approach to each microchip connection. The bonder is also capable of handling a wide range of microchip sizes and shapes. It has an optionally powered dual-nozzle head assembly, which allows the user to fine-tune the location and angle of the bonder's nozzle assembly in relation to the microchip being bonded. This enables a successful bonding of microchips in varying sizes and shapes. ACB-3000 bonds microchips with up to seven times more speed than traditional wire bonding, and up to 10 times the durability, making it an ideal choice for high-reliability operations. Additionally, the bonder supports an advanced thermal control system that offers accurate temperature control during the bonding process. Finally, ACB 3000 has a number of dynamic stability features that minimize the effects of vibration on the bonding process. These features work together to ensure the bonder's high stability and accuracy. This bonder also has a controlled reclining axis that allows the bonder to recline during the bonding process in order to maintain optimal contact between the bonder's nozzle head and the microchip being bonded. In short, SHINKAWA ACB-3000 is a reliable, high-precision bonder ideal for connecting microchips to circuit boards and substrates. Its high specifications and features make it an excellent choice for reliable, high-speed operations.