Used SHINKAWA ACB-3000 #9235807 for sale

SHINKAWA ACB-3000 is a fully automated and reliable wire bonding solution that is designed for speed and durability. This high performance bonder is the perfect solution for development and production of applications ranging from small, complex designs to larger PCBs. SHINKAWA ACB 3000 has a built-in high precision, dual stage indexing system for precise and accurate movement during the ultrasonic wire bonding process allowing up to 3mm wire diameters to be used. It can bonding speeds up to 600KHz with a maximum bond distance of up to 3000mm. This high-performance system is also equipped with a segmented bond window for efficient viewing and natural light illuminating the entire workspace. ACB-3000 is designed for automatic bonding and comes with a powerful integrated controller providing an array of features including PLC display, dynamic control system, tray cleaning and feeding, bonding head calibration, automatic wire pick up and a touch screen interface. This allows for more efficient and reliable wire bonding process and a controlled environment to ensure the highest quality results. ACB 3000 is suited for a broad range of production tasks, with temperature range adjustment ranging from -40°C to 100°C and precise wire bonding accuracy up to 0.01mm. It also has comprehensive diagnostics through which the wire bonding process can be monitored and troubleshooted if needed. An additional feature such as the wire pre-stretching and a processing capacity for up to 8 wires per head makes this bonder even more versatile. The robust construction and superior performance of SHINKAWA ACB-3000 make it a reliable bonding solution for the most challenging applications. The high-quality precision of SHINKAWA ACB 3000 offers the flexibility of a wide range of bonding configurations and a dependable method for all types of wire bonding needs.