Used SHINKAWA ACB-3000 #9366151 for sale

SHINKAWA ACB-3000 is a high precision bonder designed for attaching metal and semiconductor components to any kind of printed circuit boards. SHINKAWA ACB 3000 has an automated process that can be used for both chip-on-board (COB) and wirebonding techniques. It offers accurate alignment and precise bonding in high volumes. This bonder is capable of continuous bonding with high repeatability and accuracy, allowing for a reliable and reliable attachment of components to PCBs. The system is also equipped with a powerful monitor that allows for the monitoring of processes. ACB-3000 is equipped with a PCB holder and a wire bonder. The wire bonder is composed of two electrodes separated by a gap. It is used for the ultra-precise alignment of wire bonds and the application of pressure to the base board/component. The wire bonding process is performed by a special contact head, which is adjustable in relation to the component. It is designed for both manual and automatic operation. ACB 3000 is equipped with a BGA (Ball Grid Array) placement system. BGA systems allow for the very precise placement of chip components with very little detailed adjustment or handling. SHINKAWA ACB-3000's BGA placement system helps reduce time-consuming and tedious operation and provides high-precision bonding. In addition, SHINKAWA ACB 3000 has an integrated monitor. It has a high-resolution monitor with a touch-sensitive interface. With its built-in monitor, ACB-3000 can accurately monitor the efficiency of the bonding process. The display provides an easy-to-understand user interface and intuitive control. ACB 3000 is a highly reliable bonder that ensures accurate attachment and precision bonding. With its advanced features and options, it is designed to meet the demands of precision and high-volume production. It is an ideal bonder for companies in the manufacturing and assembly of printed circuit boards and related components.