Used SHINKAWA ACB-3000 #9383146 for sale

Name: SHINKAWA ACB-3000
Brand: SHINKAWA
SKU: 9383146
Availability: InStock

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Bonders

Manufacturer

SHINKAWA

Model

ACB-3000

ID: 9383146

Vintage: 2011

Wire bonders Target material Variety: Small signal transistors, diodes Lead frame Width: Universal 20-92mm, sealed 8-60 mm Length: Universal / Sealed common 95-262 mm Thickness: Universal 0.1-0.3 mm, sealed 0.1-0.5 mm Wire: Gold wire, Φ 15-38 μm (2" both flange spools used) Bonding method: Au wire bonding by thermosonic bonding Bond speed: 50 ms / 0.7mm wire Wire length: 4 mm (Maximum) Wire bend: Within 50 μm Bond area: X Bond Area: Universal / Sealed Common 66 mm (Camera offset 4-10 mm) Y Bond Area: Universal 80 mm, sealed 70 mm (Camera offset 6-12 mm) Bonding accuracy: ± 3.5 μm (± 4.5 μm when using forming gas) Load time: 3-150 ms (0.1 ms / Step) Bond load: 30-2940 mN (1 mN / Step) Search speed: 1-80 mm / s (0.1 mm / Step) Bonding position setting: Self-teaching method Roader / Unloader section Magazine size: Width 23-102 mm, length 110-265 mm Movement pitch in each direction: 10 μm / Step Transport method: Universal: Digital type clamp method Sealed: Digital pin feed method Feed pitch: 71 mm (5 μm / Step) Heat block heating range: Room temperature to 320°C Heating range when using forming gas: Room temperature to 300°C Compressed air: 0.5 MPa, 90 L / min Vacuum: -74kPa Forming gas: 200 kPa 10L / min Power supply: Single phase, 100VAC, 50/60 Hz 2011 vintage.

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SHINKAWA ACB-3000 is an automated friction bonder that is designed to provide consistent, reliable part-to-part and wire-to-part bonding for various sector components. This industrial-grade bonding equipment is suitable for large-scale production, enabling users to quickly and efficiently bond various components with dependable results. SHINKAWA ACB 3000 comes with an intuitive and powerful programmable logic controller (PLC) that allows for swift and straightforward setting of operational parameters. This makes it possible to customize the bonding process and achieve optimal repeatability while using the same set of parameters. The PLC also features a digital display monitor that allows the user to track the operation progress in real-time. ACB-3000 allows for automated loading, bonding, and unloading of components. The major components of the device include feeders, a bushing, an upper plate, and a platen. During the operation process, the feeders supply the parts to the bushing. The upper plate then pushes the parts down onto the platen where friction bonding occurs. The parts are then delivered to a designated unloader. ACB 3000 utilizes a sophisticated vision system that aids the device in locating, positioning, and aligning components accurately. This ensures that components are bonded correctly and securely. In addition, the device is equipped with a number of sensors for monitoring process temperature, current, and voltage. This helps to avoid the formation of dry joints and provides optimal bond quality. SHINKAWA ACB-3000 has an advanced motion control unit that allows for smooth bonding and wires movement. SHINKAWA ACB 3000 also uses a unique force feedback machine that sends real-time measurements to the PLC. This ensures that the device is always working at the optimal bonding force for every application. ACB-3000 offers a rugged and efficient powerful bonding solution for various industrial sectors. Its intuitive PLC, intuitive vision tool, motion control asset, and force feedback model make it an excellent choice for large-scale production. The device is highly versatile and efficient, and is suitable for various semiconductor and electronics applications.