Used SHINKAWA ACB-400 #293809345 for sale

SHINKAWA ACB-400 is a fully automated bonder designed to provide precise and dependable surface mount device (SMD) solder bonding. It is the latest model in the ACB line from SHINKAWA Co. Ltd. of Japan, a leader in SMT assembly technologies. ACB-400 is capable of meeting the most demanding bonding process requirements, with speed and precision. It features an advanced drive mechanism that provides excellent bonding accuracy, and a set of fully automated processes including vision correction. It can bond fine pitches of less than 0.3mm, and uses advanced parameter settings that allow for significant cycle time reduction and improved assembly performance. In particular, SHINKAWA ACB-400 features a highly efficient design, featuring a 5-axis axis control equipment for accurate and versatile welding and bonding. It also includes a fully automated bead-check system, allowing for real-time accuracy checks and preventing errors during the bonding process. The unit also incorporates a 2D/3D vision based alignment machine for quick and accurate placement of small components. ACB-400 further features an open controller architecture, and is compliant with Industry 4.0 and IoT protocols. This ensures that the machine is always connected in a smart factory environment, and is able to receive remote service and monitoring. Furthermore, SHINKAWA ACB-400 is capable of performing integrated 3D process steps, which allows for even greater process control and accuracy. In addition, ACB-400 is also built with safety in mind. It is equipped with a safety shield that ensures compliance with the highest safety standards. Furthermore, the unique shielding provides operators with supervised process monitoring and real-time risk analysis. Overall, SHINKAWA ACB-400 is an intuitive and powerful bonder that can deliver high-precision and efficient results for precise SMD solder bonding. With its intuitive operation and automated processes, ACB-400 is the perfect choice for businesses seeking to take their SMD assembly to the next level.