Used SHINKAWA ACB-400 #9168774 for sale

SHINKAWA ACB-400
Manufacturer
SHINKAWA
Model
ACB-400
ID: 9168774
Vintage: 2006
Wire bonders 2006 vintage.
SHINKAWA ACB-400 is a high-performance bonder designed for the assembly, encapsulation, and joining of small parts. The machine is equipped with a precise binocular imaging equipment to ensure that parts are held in alignment throughout the bonding process. It also boasts an advanced servo-controller and high-speed motion control technology to achieve speeds of up to several hundred parts per minute in the most demanding production applications. ACB-400 bonder features a robust, high-accuracy, electro-thermal system, which provides the most precise and repeatable temperature control in any production environment. The machine is able to bond materials such as titanium, gold, silver, molybdenum, aluminum, ceramic, and aluminum alloys with precision and repeatability. The bonder offers a wide range of configuration options, including custom end-effectors, to ensure it can meet all of the customer's desired production requirements. The bonder is also equipped with a digital pressure control unit that ensures that accurate pressure is maintained throughout the entire bond process. This allows each part to be bonded with consistent strength and prevents over- or under-pressurizing of the bonding material. The bonder further features a unique press-mixing machine to ensure that the bonding material is thoroughly mixed and homogeneous before it is applied to the parts. This avoids any uneven distribution or excess amounts of bonding material, which can cause unwanted bulges in the finished product. In addition, SHINKAWA ACB-400 bonder also features accurate vision-based positioning tool and built-in tools for alignment and characterization. This allows the machine to precisely position parts prior to the bonding process, which is critical for achieving consistently high-quality results. Finally, the bonder can be connected to a personal computer to provide the operator with real-time information on the progress of the bond process, as well as allow for monitoring and archiving of bond data. In sum, ACB-400 bonder is an excellent choice for a variety of production applications, thanks to its precision binocular imaging asset, advanced servo-controller and high-speed motion control technology, digital pressure control model, vision-based positioning equipment, and overall versatility. With its reliable, precise, and repeatable performance, SHINKAWA ACB-400 bonder is an excellent choice for any production environment.
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