Used SHINKAWA ACB-400 #9169190 for sale

SHINKAWA ACB-400 is an advanced and reliable bonding tool used in manufacturing processes such as wire bonding, die attach, and flip chip applications. This device is designed specifically for the latest technological advances in thermosonic gold ball bonding, and its compact size makes it ideal for use in tight production environments. ACB-400 provides the flexibility to bond wide varieties of wire sizes and shapes, while its accurate system control allows precise thermal parameter setting for optimal bonding results. SHINKAWA ACB-400 features a high-powered and reliable motor, which enables efficient ball bonding in seconds and minimized jig clatter. It is equipped with precision linear motors with speed ranges that can be adjusted to match exact bond requirements. ACB-400 has an integrated optical system to guarantee consistent bond position accuracy, as well as a range of measurement/shaving capabilities which makes it suitable for a wide range of applications. SHINKAWA ACB-400 also utilizes advanced ultra-sonic vibration technology for improved bonding results and a bonded area without any broken or misaligned fibers. This device is also equipped with an adjustable temperature control system to allow for precise thermosonic ball bonder performances. Additionally, this device is equipped with user-friendly programming and display capabilities, along with a USB connection for easy programming and set-up. For safety, ACB-400 is engineered with an integrated microprocessor that monitors and control functions, such as the speed, current, bonding process, and other vital parameters. The device has a sturdy wooden housing with a dust-proof and fire-resistant aluminum base and is IP-rated for continuous working in hostile environments. Moreover, its CE-certified design ensures compliance with safety standards. In conclusion, SHINKAWA ACB-400 is an advanced and reliable bonding tool used in a variety of applications, such as wire bonding, die attach, and flip chip. This device features high-precision motors and integrated optical systems for improved bond positional accuracy, along with vibration technology, temperature control systems, user-friendly programming, and display capabilities. This device also has an IP-rated and CE-certified design, making it a durable and reliable tool for various industrial bonding processes.