Used SHINKAWA ACB-400 #9221070 for sale

SHINKAWA ACB-400 Bonding Equipment is a powerful bonder for precision bonding of semiconductor devices, such as integrated circuits (ICs), die and leadframes. The bonder is designed to provide reliable and high-quality performances at high throughput to ensure total process control and quality control. The bonder features superior accuracy and repeatability to meet the demands of micro-electronics assembly industries. ACB-400 Bonding System is capable of delivering high wire bonding throughput rates with minimal wire diameter error. This is an automated bonder unit with advanced user friendly features like automatic wire feeding, advanced force control, repeatable process cycle, multiple encoder machine, full touch-screen interface, and multiple vision monitoring methods. The tool also features a high accuracy XY table with a closed-loop position control. This enables high densities and uniform wide spacing of bonds for ICs and leadframes of various sizes and types. SHINKAWA ACB-400 Bonding Asset provides reliable and repeatable wire bonding with precision control. This is achieved with its high precision micrometer driven stages, servo-assisted 6-axis movements, and encoder based laser wire alignment. The short wire bond trim cycles make this model an ideal choice for quick turnaround production. The built-in high-speed auto-capture equipment makes sure only the best placement of the wire bonds for superior consistency. ACB-400 Bonding System also boasts an all servo-driven wire pull switching unit for high resolution setting and enables multiple wire pull settings. High-speed cassettes facilitate rapid chip to leadframe bonding. Furthermore, the machine allows multiple bonding modes, such as bonding vertical or horizontal leads, forcomplex ICs, die and leadframe of different sizes and shapes. SHINKAWA ACB-400 Bonding Tool provides flexibility in programming and parameters like leadframe size, IC design, wire type, looping, height, and other wire bond characteristics. The asset also features an advanced data logger that keeps track of the complete process details and archiving it for later review by quality engineers. The bonder comes equipped with an integrated model monitor that provides feedback on machine health and performance data. In conclusion, ACB-400 Bonding Equipment is a reliable bonder for high throughput with repeatable process control. The bonder is designed to provide superior accuracy and repeatability with multiple encoder system, high accuracy XY table with a closed-loop position control, and integrated unit monitor for feedback on machine health and performance data. This machine is an ideal choice for quick turnaround production and ensures high wire bonding throughput rates with minimal wire diameter error.