Used SHINKAWA ACB-450 #9110445 for sale

SHINKAWA ACB-450 is an Automatic Controlled Bonding (ACB) machine designed for prototype or low-volume production. This bonder has a micrometer-accurate, high-precision automated bonding head that provides fast component placement, soldering, and cleaning. It employs a nonstop, low-load bonding process that reduces strain on parts and allows for rapid and repeatable operation. ACB-450 is ideal for devices demanding highly precise bonding, such as ceramic substrates, glass substrates, ceramic packages, and multi-layer printed circuit boards (PCBs). The flexible design can also accommodate a variety of other components, including wire-bonding, and other materials such as copper, aluminum, and gold. It is also capable of soldering on a variety of different substrates. SHINKAWA ACB-450 has a control equipment using a 5-inch LCD touch panel and a Windows-based HMI software. The system can be programmed to complete the bonding process, allowing for fast throughput and inspection. The bonder is also equipped with safety and protection systems, such as temperature control, short circuit isolation, and emergency stop functions. The bonder is also equipped with sensors for monitoring the bonding process, including thermocouples for measuring temperature, a pressure sensor for controlling the bonding pressure, a force sensor for controlling the force applied to the components, and a displacement sensor for controlling the displacement of each component. The sensors are capable of producing accurate measurements to ensure consistent adhesive bonding. ACB-450 allows for fine-tuning of the bonding parameters, providing precise control and operation. The unit can be customized to suit different materials, parts, and production volumes, providing a flexible solution for the production floor. In addition, the bonder has a self-diagnostic machine with comprehensive data storage, enabling easy maintenance and monitoring of the tool. SHINKAWA ACB-450 is an ideal choice for precision applications in the electronics industry. Its integrated structures, superior performance, and robust features make it a top choice for high-precision bonding applications.