Used SHINKAWA ACB35 #9365855 for sale

SHINKAWA ACB35 is a high precision bonder designed for optimum production and efficiency in the manufacturing process. It is able to bond a wide variety of substrates, including cover glass, laminates, foils, ceramics, and plastics. ACB35 can be used for various process needs, such as laminate bonding, glass shot peening, and device packaging. The main advantage of SHINKAWA ACB35 is its excellent vibration and temperature control capabilities. ACB35 uses an advanced vibration control system that properly adjust for the different coefficients of expansion of the material being bonded. The temperature control system of SHINKAWA ACB35 is designed to maintain a stable bonding temperature to avoid any warpage, resulting in a stronger bond. ACB35 features a wide range of bond heads, which enables it to handle different substrate sizes and shapes. Additionally, its wafer and frame feeder systems, relevant to opto-electronic process, enable the device to handle a variety of materials. Through its user-friendly control panel, operators have the ability to modify parameters and view process data including cycle time, relative humidity, and temperature history. Furthermore, SHINKAWA ACB35 is equipped with self-diagnosis systems to detect and alert operators of any errors to ensure that the process is running smoothly. In addition to the features previously mentioned, ACB35 also provides a wide variety of process capabilities that are ideal for applications including opto-vibration bonding, semiconductor die bonding, and opto-lasers. Also, the bonder is designed with a zero component clearance system to ensure that there is no damage to sensitive components caused by debris or shifting of parts during the bonding process. SHINKAWA ACB35 is a powerful bonder, perfectly suited for the demands of the modern manufacturing process. With its extensive array of features, operators have the ability to produce reliable and precise bonds again and again.