Used SHINKAWA ACB35 #9365856 for sale

SHINKAWA ACB35 is a state-of-the-art bonder designed to join materials together using heat and pressure. It features the latest in precision motion control, temperature management, visual inspection, and data management capabilities for unsurpassed bonding accuracy and consistency. ACB35's advanced optics, nano-level linear encoder, and embedded controller make it a leader in efficiency and consistency, allowing for excellent process control. The main components of SHINKAWA ACB35 include a power supply, process control unit, and bonding head. The power supply controls all electrical power, including AC, DC, and pulse. It also integrates power algorithms, allowing for precise thermal control of various materials during the bonding process. The process control unit monitors the position of the bonding head, controlling the motion of the head and ensuring that the bonder travels the correct path and to the correct depth. The embedded controller optimizes the bond parameters for each job. ACB35 is designed to join metals, plastics, composites, and other materials. It has two modes - hot bar and thermocompression - allowing it to create both lap joints and die bonds. The process is consistent and reliable, with the power supply accurately controlling temperature and time. The bonding head can be used for distributed force, allowing for even pressure between the two materials, resulting in a superior joint. SHINKAWA ACB35 has a built-in pressure monitor, allowing for exact placement of the bonder's head and ensuring maximum integrity of the bond. ACB35 offers a high degree of process control, with its visual inspection capabilities and comprehensive data management functions. This allows for maximum data accuracy and traceability. The integrated controls also enable quick set-up, allowing for fast changeovers between jobs and settings, boosting production and efficiency. SHINKAWA ACB35 is a reliable, efficient, and cost-effective bonder that can help to maximize productivity.