Used SHINKAWA ACB35 #9365857 for sale

SHINKAWA ACB35
Manufacturer
SHINKAWA
Model
ACB35
ID: 9365857
Vintage: 2002
Wire bonders 2002 vintage.
SHINKAWA ACB35 bonder is a state-of-the-art bonding machine designed for precision and accuracy. It has a three-dimensional advanced control equipment with servo motors that enable it to quickly and accurately bond components in a variety of configurations. ACB35 has a powerful bonding force of up to 25 tons, and can bond a wide variety of substrates, including steel, aluminum, glass, quartz, and plastics. SHINKAWA ACB35's control system provides an easy-to-use interface that can store up to 40 different geometries for repeat production and engineering changes. The software also includes extensive diagnostics and safety features, allowing for optimized performance and repeatability. ACB35 features rapid actuators that enable high-speed production rates, and provides extremely low bonding temperatures and high accuracy levels for many applications. The integrated thermal control unit works in tandem with the heater block, allowing SHINKAWA ACB35 to precisely adjust the heat in order to ensure the most effective results. Additionally, the Advanced Redundancy Machine provides extra piece of mind in production, as it can detect errors and promptly shut down the process if necessary without delay. ACB35 is also incredibly easy to maintain and comes with a detailed manual, providing a step-by-step guide to running and troubleshooting. In addition to its impressive capabilities, SHINKAWA ACB35 is compact, making it ideal for production runs in more confined workspaces. It is extremely fast with its high-speed actuators and the integrated cooling helps ensure safety and durability. ACB35 also has an array of expansion ports to connect to external devices like scanners, robotics, and other compatible processes. This makes it an incredibly versatile tool suitable for a wide variety of applications. In conclusion, SHINKAWA ACB35 is an incredibly efficient and reliable bonding machine designed to provide precision and accuracy. It is easy to use with advanced controls and can bond a wide variety of substrates. It is also capable of high speed production rates, and comes with an array of additional features to ensure the most effective results.
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