Used SHINKAWA ACB35 #9365859 for sale

SHINKAWA ACB35 is a highly efficient and versatile Bonding machine capable of processing a wide range of components. Featuring a user-friendly interface, this machine is easy to operate, allowing users to quickly bond components in high volumes and in a variety of shapes and sizes. ACB35 is a fully automated machine, designed for placement and bonding of SIM connectors, LED assemblies, chip carriers, display modules, sensor ICs, and discrete ICs. SHINKAWA ACB35 includes four nozzle bonding heads that can be configured for different types of components. The two dual nozzle heads are capable of handling thin and flat components with the pick and placement head controlling angular and taller parts. The bonding head allows for various specialized bonding jobs. With manual and automatic ability, users can select the appropriate size of nozzle head for the job as well as the bonding mode. ACB35 has a maximum bonding speed of 40 cycles/second and is capable of performing complex patterns on high-density substrates. It also has a built-in alignment algorithm which can be adjusted depending on the job requirements. The machine is equipped with horizontal and vertical vision cameras which enable the detection of substrate alignment before bonding. Additionally, the machine is equipped with an optical inspection system and a thermal imaging system for ensuring a high-quality bonding process. SHINKAWA ACB35 can guarantee fast cycle times with a high-speed bonding process. It can also adjust the heating pressure according to the size and shape of the component to be bonded. The bonding parameters can be customized to the customer's needs so that the desired bonding quality can be achieved. In order to guarantee a high-quality bonding process, ACB35 has an inbuilt vacuum system that ensures reliable pick-up of the component being bonded. The machine can be configured to work with manual loading and unloading options, or with automated load and unload systems. SHINKAWA ACB35 also offers an audit trail with all the parameters and adjustments set for the bonder. This can be used to tune the settings and follow up any abnormalities,making it easier to troubleshoot problems. ACB35 is engineered for optimum size and power to work even with high-density circuit board layouts. The smart design of this machine ensures a consistent bonding process with minimal maintenance needs and no human intervention.