Used SHINKAWA ACB35 #9365860 for sale

SHINKAWA ACB35 is a high performance wire bonder used in the production of semiconductor devices. It is an advanced equipment that offers superior bonding characteristics and repeatable production. ACB35 is a fully automated, multi-wire bonding system that delivers consistent, reliable performance by using an advanced proprietary technology called Multi-Wire Bonding Unit (MWBS). It has the ability to bond four different wires and is equipped with a wide range of features to ensure efficient and reliable production. The machine is designed to accommodate various types of wires, including gold, silver and copper. With its high-speed, multi-wire bonding process, SHINKAWA ACB35 can achieve a cycle time of as low as 0.5 second. The tool also features integrated diagnostics and a programmable memory. This enables operators to monitor the progress of the bonder and make necessary adjustments to ensure improved performance. In addition ACB35 has several important features for secure operation. These include a self-adjusting arm, PCB edge-stop detecter, wire-feeder/feed-die sensor, auto-positioning and an interlock asset to prevent over-travel. The model also includes a precision X-Y axis stage and a thermal monitoring equipment to ensure a quality bond. SHINKAWA ACB35 is designed for high-volume production applications, and its large main memory can store up to 100 recipes for quick set-up and recall. This helps reduce cycle times and improve production output. The system also offers repeatable accuracy and a wide range of bonds to give customers a customized solution for their production needs. ACB35 is extremely user-friendly, with a color touchscreen for easy programming and operation. It also offers various customizable features including sequence pattern, detection parameters, and adjustable speed/time settings. Its intuitive graphical user interface makes it easy to monitor vital parameters such as current, temperature and voltage. Overall, SHINKAWA ACB35 is a high quality, advanced multi-wire bonder that offers superior bonding characteristics and dependable performance. It is an ideal choice for high-volume production applications due to its high speed, repeatable accuracy and customizable features.