Used SHINKAWA ACB35 #9378162 for sale

SHINKAWA ACB35 is a high-precision gold ball bode bonding equipment designed to meet the needs of the semiconductor industry. This advanced system combines a dual-axis (X-Y) robot arm with a high-speed vision unit and a high-frequency high-accuracy bonding head. The robot arm can move at a rapid speed of 1.2 m/s, and the bonding head can dispense up to 30w during operation. The two-axis motion machine provides accurate alignment between the bond and the substrate, ensuring high-quality, reliable bonds. ACB35 is designed to provide precise control of the bond angle, pressure, speed and heat sources which is ideal for industrial processes. The high-speed vision tool analyzes the images taken by the camera and provides quick feedback on the quality of the bond. This allows the asset to optimize the bond parameters in real-time and ensure that the bond strength meets the required standards. SHINKAWA ACB35 also has an optional AI-based Auto Tuning feature which can automatically adjust the parameters to ensure the best possible bond quality for each product. ACB35 is designed to fit into standard size production lines. This allows for efficient integration into the production process and easy maintenance. The machine is capable of full servo control, providing high throughput and rates of up to 75 bonds/second. The model also includes advanced safety features such as a programmable safety interlock switch and a visual alarm equipment. All in all, SHINKAWA ACB35 is a high-performance gold ball bode bonding system designed to provide precise control of the bond angle, pressure, speed and heat sources. The advanced features of this unit make it ideal for high-precision and reliable industrial applications.