Used SHINKAWA ACB400 #9365866 for sale

SHINKAWA ACB400 is a precision, high-speed, automatic bonder designed for the production of fine-pitch and high-density bonding applications. It is capable of producing even the most complex high-quality and reliable micro-BGA and WLCSP. This visionary machine incorporates advanced technologies such as a highly-accurate X-Y stage combined with high-repeatability vision alignment which along with its ultra-fast servo-controlled bond head and XY stage, enable fast, precise and repeatable production of flip chips, BGAs, LCCs, Stacked Die and other forms of flexible ICpackage bonding. ACB400 utilizes air-based compression bonding, a method which promises to be more predictive and reliable than solder ball bonding. This is enabled by high-precision components such as a pin-chartered scanner, an ultra-sensitive nosepiece, an accurately aligned camera, as well as high-force compaction capabilities. The machine also features a non-reflective coating on the internal lenses, which greatly increases identification accuracy and significant visual contrast during alignment operations. In terms of speed and accuracy, SHINKAWA ACB400 is truly unrivalled. The cutting-edge vision and X-Y stages in combination with cutting-edge servo control systems, enable a cycle time as low as 2.5s per bond, and an accuracy of up to 1000DPM. The machine's accuracy is further refined through its integrated servo-loop technology, which produces accurately placed and consistently sized and shaped bonds in a fraction of the time required by traditional manual bonding. From a design perspective, ACB400 exhibits an ergonomic approach, utilizing an intuitive user interface and integrating in-built diagnostics that make maintenance operations considerably easier. The machine is also highly reliable, with in-built self-testing processes as well as an array of external temperature sensors, and a life cycle of more than ten million operations. In the end, SHINKAWA ACB400 offers a cost-effective, high-performance solution to a wide range of ICpackage bonding needs. From fine-pitch and high-density components to high-speed and accurate production performance, this machine provides the features to produce the most reliable and complex plastic packages. The added precision and repeatability make ACB400 a great choice for applications which demand reliable bonds every time.