Used SHINKAWA COF-120 #9019207 for sale

SHINKAWA COF-120
Manufacturer
SHINKAWA
Model
COF-120
ID: 9019207
Wafer Size: 4"-8"
Inner lead bonder, 4"-8".
SHINKAWA COF-120 is a bonder that is designed to bond high temperature copper and aluminum foils for use in a variety of industries. This equipment is specifically designed to bond materials that have thicknesses that range from 0.1mm to 0.3mm. The machine also comes with a wide array of features that offer precise control over the bonding process, making it a perfect choice when it comes to temperature-sensitive applications. COF-120 has a user-friendly interface that is easy to use and understand. The main control panel includes a digital display that shows the temperature setting of the machine along with other settings. Additionally, the machine also comes with a numeric keyboard and an LED display that helps the user to set the parameters for the bonding process. The built-in, programmable timer can be adjusted in order to enhance the accuracy with which the parameters are set. The machine is designed to work with a wide variety of materials that are used in a number of industries. The machine is highly efficient, and can bond materials with a heat resistance of up to 350 degrees Celsius. Additionally, the bonding process is stable with minimal additional heat input, making it perfect for applications that require tight production lines. It can also be combined with other SHINKAWA machines to form a semi-automatic production line. SHINKAWA COF-120 also comes with an adjustable air pressure tank that can be used to maintain the pressure at the optimal level. This ensures perfect and consistent results with every bonding cycle. The machine also has a built-in safety switch that stops the unit if any abnormality is detected. Additionally, the machine is relatively easy to maintain and clean, making it an ideal choice for high temperature bonding applications. Overall, COF-120 is a reliable and powerful bonder that can be used in a wide variety of applications. It offers precise control over the bonding process and is designed to work with a wide variety of materials. Additionally, it is relatively easy to use and maintain, making it an ideal choice for temperature-sensitive applications.
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