Used SHINKAWA COF-300 #293660140 for sale

SHINKAWA COF-300 is a high-performance, dual-stage die bonder for semiconductor packaging. It is designed for automatic die attachment and wire bonding processes of flexible printed circuit boards (FPCs) and components with small-pitch leadframes. SHINKAWA COF300 has a two-stage bonding system with a high-accuracy die bonding stage and a low temperature wire bonding stage. COF 300's die bonding process is based on a modified version of the conventional traditional MicroThermal bonding (MTM) method. The bonded die is adjusted in two directions and can be secured at any angle for a stable connection. An integrated ultra- accurate vision system further ensures precise die placement adjustments within ±0.04 mm accuracy. The unit can bond multiple dies with die pad widths of 0.3 mm. The low temperature process of COF-300 is based on the microthermal-activation (MTA) method which uses positive pressure and pre-heating to ensure accurate wire bonding accuracy. The built-in vision system further helps achieve 0.0008mm clearance and tracking accuracy. SHINKAWA COF 300 can be programmed for single point, multi-point and ultra-fine wire bonding. For small-diameter wires, COF300 can bond wire up to 0.25mm diameter. SHINKAWA COF-300 provides a wide range of programming and diagnostics capabilities both online and offline. The software enables process quality checks as well as program updates. The COF-300also provides a comprehensive safety feature which monitors environmental changes in temperature, air pressure, and humidity, as well as the status of machine-attached components. SHINKAWA COF300 is built to last, as its design features a rugged all-metal construction and an ergonomically designed user interface for easy operation. With its all-in-one integration and its high-precision, performance capabilities, this unit is an ideal solution for small-pitch die and wire bonding processes.