Used SHINKAWA COF-300 #293660907 for sale

Manufacturer
SHINKAWA
Model
COF-300
ID: 293660907
Vintage: 2005
Flip chip bonder 2005 vintage.
SHINKAWA COF-300 is a state-of-the-art bonding device designed to help improve the efficiency of bonding processes. This machine operates by heating thermoplastic film with a hot air nozzle, melting the film onto the base material to form a high-strength bond. The hot air nozzle provides a more precise application of heat than other types of bonders, reducing the risk of bubble formation or other imperfections. The temperature of the hot air nozzle is adjustable to match the application, allowing for the optimal bond strength to be achieved. SHINKAWA COF300 is a fast machine, operating at 19 m/min, making it ideal for high-volume applications. It is also versatile, working with a range of base materials and thermoplastic films. The metal bed base ensures accurate feeding of the material, and the adjustable tension guides help to control the tightness of the bonds. The rotary cutting mechanism enables a clean and consistent cut along the edge of the film. The operator can control all of the functions from the control panel, including the temperature, the speed, and the tension, making the machine highly user-friendly. A range of accessories, such as a height-adjustable console and jig, can be added to facilitate the bonding process. This machine also has a low noise level and requires minimal maintenance, making it ideal for most industrial applications. COF 300 is a reliable and efficient bonding machine, making it a popular choice for many industries. With its adjustable features, user-friendly control panel, low noise level, and minimal maintenance requirements, it is an excellent choice for those looking for a high-performance bonding device.
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