Used SHINKAWA COF-300 #9198998 for sale
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ID: 9198998
Wafer Size: 8"
Vintage: 2005
Flip chip bonder, 8"
HEPA Filter included
Vision option
2005 vintage.
SHINKAWA COF-300 is an advanced bonding equipment designed for highly efficient and reliable assembly of composite components used in a range of industries, particularly the aerospace and automotive industries. The machine uses in-line, laser-aided fiber placement techniques to accurately bond positive and negative sides of complex components which require complex geometries and precision accuracy. The machine is designed for easy setup and operation with a low footprint, making it ideal for modern production lines. SHINKAWA COF300 can handle materials with a range of thicknesses from 0.2mm to 5.5mm, allowing maximum flexibility when processing a range of components. Its fiber placement accuracy is ±0.2mm, meaning it can bond parts with a very tight tolerance and excellent surface finish. COF 300 has a variety of features that simplify operation and reduce part damage, including: a high-resolution color monitor for positioning and alignment, a programmable lamination window, and an optimized speed control system that automatically adjusts machine speed according to bond line angles. In addition, the machine has the option to pre-treat, die cut, or pre-bond composite components. The machine also has a dust collection unit to reduce pollution, making it suitable for certain in-plant requirements. COF-300 is fully automated, enabling production speeds up to 300 bonds per minute. It also has a PLC (Programmable Logic Controller) to control the movement of the bonding head, which means that all production steps are controlled from one central location. In addition, the machine is equipped with tools for both manual and automated loading and unloading of components, and can be remotely monitored by a computer. Overall, SHINKAWA COF 300 is an advanced and reliable bonding machine designed to optimize production lines with maximum efficiency, precision, and safety. With its easy setup, low footprint, and extensive features, it has become a popular choice for the aerospace and automotive industries in particular.
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