Used SHINKAWA COF-300 #9198999 for sale

SHINKAWA COF-300 is a next generation of all-in-one non-contact laser bonder designed to be used for the high-speed assembly with die attach, sealing and wire bonding. This innovative device is equipped with a high-powered laser, an advanced image processing and computer vision solution, a monitor sensor and an innovative manipulator arm. It features a simplified operation, improved accuracy and efficiency and easy setup and maintenance. The laser used in SHINKAWA COF300 is powerful enough to enable the bonding with die attach, sealing and wire bonding at high speed. It comes with 16 independent laser beams which can be used for automated placement and heat treatment. The monitor sensor is also included which makes it possible to detect any deformation in the product process. The image processing and computer vision solution of COF 300 is also quite advanced. This technology can perform fault detection and recovery, shape recognition, laser focus adjustment, and various other functions. The monitor sensor can detect any deformation caused by the use of various types of materials such as glass, polyimide, photo-responsive adhesive, and others. The innovative manipulator arm of the machine can be used to perform various operations and increase the speed of the product assembly. The arm can be programmed to perform a variety of processes including precision spot welding, high-precision soldering, spot glue filling and other operations. COF-300 bonder is really a great tool for improving the speed and accuracy of product assembly. With the various advanced features, improved accuracy and efficiency, reliable operation and easy setup and maintenance, it provides a great platform for advanced assembly processes. Its capability to efficiently perform fault detection and recovery makes it an ideal machine for ensuring the highest quality of products in the most efficient way.