Used SHINKAWA COF-300 #9200920 for sale

SHINKAWA COF-300 is a high performance bonder that is designed to meet the demands of advanced industrial production in semiconductor packaging and assembly. This bonder offers superior performance for precision micro-joining and can handle all kinds of components, including very thin wires with smaller diameters. It has an advanced fluxless soldering process that can be easily controlled with its user-friendly touch-screen interface. SHINKAWA COF300 has a compact C-Frame design that enables it to be used for a variety of different applications. The modular design also allows for a quick and easy setup, while its advanced control equipment provides a high degree of flexibility in production. The bonder is equipped with an independent flux supply system, low force vacuum clamping plate and an accurate temperature control unit that ensures precise solder joint formation. COF 300 is capable of performing adhesive-type and reflow soldering on a variety of substrates and components. Its advanced PLC control machine can store up to 500 programmable recipes and speeds up the program set-up time while its process monitor ensures reliable production results. The bonder is also equipped with a safety interlock tool that prevents accidental operation and restricts access to authorized personnel only. COF-300 is the ideal machine for high-precision soldering and offers excellent reliability due to its high quality components and robust design. The machine is also suitable for low volume to high production volumes, while its integrated cooling asset allows it to be used in high and continuous production. COF300 provides an advanced solution for all types of high-precision bonding, soldering and assembly applications.