Used SHINKAWA COF-300 #9235805 for sale

SHINKAWA COF-300
Manufacturer
SHINKAWA
Model
COF-300
ID: 9235805
Wafer Size: 8"
Flip chip bonders, 8" 2005-2007 vintage.
SHINKAWA COF-300 is a high-quality automated bonding machine that is used in various industries, from automotive to electronics. The machine has been designed for hot melt bonding applications, and can handle a wide variety of materials, including rubber, plastics, leather, and metals. SHINKAWA COF300 features precise and repeatable temperature control, which allows for consistent results. It also features a wide range of heating zones, with up to five temperature settings, allowing for greater control over the curing process. This ensures that parts are properly bonded and achieve the desired results reliably. The machine is powered by a powerful servomotor, providing a smooth and precise running of the belts. The angle of the belts or head can also be adjusted, allowing for further customization of the bonding process. Furthermore, the machine is equipped with an automated placement of up to 100 parts per hour, minimizing the time required to complete a task. The machine is simple to use and comes with an intuitive control panel. The graphical display makes it easy to adjust and monitor the settings. It also includes an automated fault-finding system and troubleshooting support. COF 300 is suitable for various applications within the automotive industry, as well as within the electronics industry. With its wide range of features, the machine allows for the efficient and cost-effective production of components. Furthermore, as a hot melt bind operation, it can accommodate those types of products which have sensitive components not requiring soldering or adhesives.
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