Used SHINKAWA COF-300 #9302543 for sale

SHINKAWA COF-300 is a fully automated, multifunctional die-bonding equipment designed specifically for the precise, high-speed bonding of die to circuit boards. Its patented multi-axis motion control allows for flexible, accurate, and repeatable bonding operations on a variety of substrates including hard-to-handle, mixed sized die. The system is well-suited for a range of die substrates and incorporates both manual and automatic bond processes. SHINKAWA COF300 features a rigid yet lightweight construction and is designed to meet the highest quality standards. It has a precision 3-axis motion control unit that ensures reliable and repeatable die-bonding by compensating for varying die sizes. The machine has a medium resolution camera that monitors die information (including size and position) as well as the bonding procedure. The camera is equipped with a high powered LED light source to improve visibility and accuracy. COF 300 allows for both manual and automatic die-bonding, depending on the user's preference and application. Utilizing the tool's manual mode, the user can manually place each die on the substrate before activating the bonding process. In automatic mode, the asset can be used to bond up to 9 dies simultaneously, increasing speed and efficiency. In addition, the model also includes a variety of software features that streamline the die-bonding process. The equipment's user interface can be tailored to meet specific die-bonding requirements, and includes adjustable display brightness, user selectable parameters, and an integrated data monitor. In addition, the system also includes an integrated storage database for archived data. SHINKAWA COF 300 is ideal for a wide range of applications including the assembly of consumer electronics, semi-conductors, and lighting components. It is easy to use and simple to maintain, making it an ideal choice for production facilities that require precise and reliable die-bonding.