Used SHINKAWA ILT 60 / COF 1000 #9398765 for sale

Name: SHINKAWA ILT 60 / COF 1000
Brand: SHINKAWA
SKU: 9398765
Availability: InStock

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Bonders

Manufacturer

SHINKAWA

Model

ILT 60 / COF 1000

ID: 9398765

Wire bonder Bonding method: Digital bonding head, constant heat method Accuracy: 5 Pm Cycle time: 2.6 Sec /IC (Bond time excluded) Bonding force: 9.8-392N (4.9N/step) Bond tool temperature: 600 A Bonding position detection function: Gray scale correlation Die pick-up detection: Position detection: Binary coded pattern matching or outline detection Ink dot detection: Defect in form detection Die size: X: 0.8mm~5mm Y: 5mm~25mm T: 0.2mm~1.0mm TAB tape: Tape supply: Reel to reel Applicable reel: 620 mm Reel shah: One type specified from $ inch, Q inches, Q 8 mm, 08 mm Applicable tape width: 35 mm - 70 mm Index type: Roller type (Indexes) Non-tension type (Loader / Unloader) Die supply: One type specified from wafer or tray Wafer frame fixing: Wafer expansion Alignment resolution: Wafer table: XY: 2.5 m/step, Θ: 0.08/Step Bonding stage: XY:1.25 p m/Step, Θ: 0.0025 /Step Bonding head: XY: 1.25 p m/Step Tool cleaning: Lap plate with rotary brush Drive source: Power consumption: 2200 W Air: 400 KPa N2 gas: 200 KPa Vacuum: -74KPa Power supply: 100 VAC, 50/60 Hz.

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SHINKAWA ILT 60 / COF 1000 is a high-powered industrial bonder designed for production line processes. It is capable of producing bond line widths ranging from 200 µm to 10 µm, with a speed of up to 20 m/min, and enables users to achieve reliable and repeatable bonding. The robust construction of the machine ensures a long life and high reliability, and it is powered by a servo motor that allows for precise position control. The built in microchip technology allows for real-time machine tuning and fault diagnostics, allowing for a quick and effective response in the event of any issue. ILT 60 / COF 1000 model comes with several customizable options, including a programmable control, dual waveform capability, adjustable wave heights, and variable speed. The machine also features a patented waveform optimization equipment that reduces waveform distortion, and it is equipped with a rotating table that allows for easy and convenient access to bonding areas. The machine is equipped with a UV curing system, which is supplied with an optional UV lamp. This unit allows for fast and consistent bonding, meaning that cycle times can be reduced and production costs can be minimized. The machine also features a wide range of safety features, including a safety interlock machine, an emergency stop button, and a comprehensive input/output circuit. Overall, SHINKAWA ILT 60 / COF 1000 is a powerful and reliable bonder which is suitable for a wide range of production line processes. The machine is easy to use, due to its remote control, programmable control, and waveform optimization tool, meaning that users can achieve a high level of accuracy with minimal setup time. The robust construction and safety features ensure a long-lasting and dependable bonder that is perfect for busy production lines.