Used SHINKAWA SBB-1410 #9178420 for sale

SHINKAWA SBB-1410 bonder is a precision bonding system designed to meet a wide range of assembly needs. The combined scanning and displacement functions provide the greatest flexibility for complex applications. SBB-1410 offers two standard models for high-precision scanning of bonding surfaces and filament bonding. The SBB-1410D is the most commonly used model, while the SBB-1410B is specifically designed to create high-precision thermal filaments. Both models feature an accurate three-dimensional scanning and displacement and a reliable bonding process. The SBB-1410B is also equipped with a special sliding chuck for generation of delicate filaments. SHINKAWA SBB-1410 has a working area of the 310mm X 310mm with a scanning resolution of 0.1 μm. The displacement resolution is 0.3 μm + 1.0 μm/10 μm and the accuracy is 0.5 μm+ 1.0 μm/10 μm. The bonding system is driven by a PLC system with a custom GUI, allowing the user to easily and quickly set up the parameters for their specific applications. The user-friendly touch-screen interface supports intuitive operation and includes a variety of help functions such as auto-tune. The bonder offers a variety of process modes and functions such as force magnification, repeat mode, and auto-tune learning. It also provides a safer and more accurate bonding process than manual setup, which can take up to 10 times longer. SBB-1410 is capable of handling a wide range of components and substrates, including some ultra-small and difficult-to-handle parts. It also offers a wide range of process gases, such as nitrogen, argon, SF6, C2F4, and others, and can work with components with different surface finishes. Overall, SHINKAWA SBB-1410 is an excellent and versatile bonder for applications requiring precision, accuracy, and flexibility. It provides an easy to use interface and advanced features to help with the assembly process. Its wide range of process options ensures that it is suitable for a wide variety of projects.