Used SHINKAWA SBB-1410 #9407712 for sale

SHINKAWA SBB-1410 is a state-of-the-art electronic bonder designed for advanced bonding performance. This equipment is a highly accurate, full automated machine that supports numerous wire bonding techniques. The single port SBB-1410 has been tested and proven for premium bonding applications, offering excellent results in terms of reliability, accuracy, and consistency. SHINKAWA SBB-1410 incorporates several patented technologies, allowing users to utilize different types of fine-pitch and ultrathin wire bonding. It enables production of high quality microstructure components regardless of the application. The equipment is designed to address the increasing demand for smallest feature sizes. It can accommodate the vast range of bond pitches from 0.1 mm (0.004") down to 0.02 mm (0.001") and is suitable for parts with a minimum feature size of 0.4 mm (0.016"). SBB-1410 has a robust design with advanced high-resolution vision and linear drive system that ensures accurate placement of the working wire. It is equipped with high-speed image transfer and ribbon handling capabilities, as well as various process control functions. The ultrasonic motor drive system of the machine assures repeatability of the drive motor. Furthermore, SHINKAWA SBB-1410 can perform a comprehensive range of bonding processes including ribbon, Ball, and Wedge bonding. SBB-1410 can be operated in various temperatures, featuring both hot and cold molding options. The cold molding option offers a better surface finish to ensure superior electrical and mechanical contact. Hot molding, on the other hand, uses high temperature to accelerate adhesion and increase bonding strength. The equipment's advanced control board and automatic measurement system helps provide high-precision microbonding. SHINKAWA SBB-1410 features a wide range of automation and process control features including auto-load/unload, alarm notification, image feedback, wire and ribbon cutting, dynamic bond pitch control, and more. With its high-speed, low-error operation and reliable bonding technology, SBB-1410 is an ideal choice for complex applications such as high-resolution displays and chipsets. This bonder is suitable for both high and low volume production scenarios, and its easy-to-use interface makes it suitable for novice and experienced users.