Used SHINKAWA SBB-310 #181738 for sale

SHINKAWA SBB-310 is an advanced three-head wedge bonder designed for high-precision and high-reliability bonding applications. It is ideal for bonding applications such as lead frames, thin film FPC, multi-layer circuit boards and chip on board (COB) packages. SBB-310 utilizes a sophisticated high-speed gantry equipment, allowing for high-speed production operation. The system accurately performs pickup, alignment and bonding head movement in order to eliminate any errors generated during placement or alignment. SHINKAWA SBB-310 employs a vision-based unit for alignment to ensure excellent accuracy, even in cases where there are subtle deviations from the ideal bond condition. SBB-310 possesses a number of advanced features including an advanced wedge bonding head, wire feeder, and an integrated vision machine. The wedge head is a high-speed, high-precision head capable of pulling and blending wire of various specified diameters. The wire feeder features an adjustable wire table for thin wire handling and facilitates greater production throughput. The vision tool is integrated into SHINKAWA SBB-310, providing excellent accuracy of bond placement and uniformity of wire length. SBB-310 is equipped with advanced monitoring, control, and diagnostic systems to ensure excellent bond quality throughout the production process. It is also capable of real-time testing and monitoring of wire elongation and loops, as well as insulation and adhesive strength. Additionally, SHINKAWA SBB-310 possesses a self-diagnostic asset that helps identify any possible problems with the equipment or the bonding process. In addition to its advanced design, SBB-310 also has a wide range of application options. It is capable of supporting a variety of bonding materials such as gold, aluminum, copper, and lead-tin. Moreover, it is also capable of supporting a variety of substrates including circuit boards, multi-layer substrates, lead frames, and chip on board (COB) packages. Overall, SHINKAWA SBB-310 offers an excellent bonding solution for applications requiring high-precision and high-reliability. With its integrated vision model, advanced monitoring, control and diagnostic systems, SBB-310 provides superior bonding and production throughput with excellent quality.