Used SHINKAWA SBB-310 #9050365 for sale

SHINKAWA SBB-310 is a microline bonder, designed to meet the needs of applications involving small scale circuit board assembly. This smart device features an integrated chip and board level bonding equipment that provides users with high quality, reliable, and repeatable joining solutions for flip chip, chip on board, and other advanced technologies. SBB-310 bonder has high precision and accuracy in joining and can be used for a variety of substrates and surface coatings. This microline bonder has a high degree of versatility, and is capable of working with various types of substrates, including lead-free materials, glass, ceramic, stainless steel, and other materials. Furthermore, it is compatible with a wide range of pressure-sensitive adhesives and chip-on-glass and chip-on-ceramic technologies. Its built-in temperature compensation feature ensures accuracy and consistency of bond lines on the substrate surface. SHINKAWA SBB-310 offers a unique two-stage speed-controlled control motor for repeatable accuracy in joining processes. It has a wide working range, with a maximum bond speed of 900 strokes per minute and a minimum bond speed of 500 strokes per minute. The speed-controlled feature enables the user to easily adjust the stroke speed according to the substrate material and bonding process. The bonder also features a built-in stopper that allows for precise height and depth adjustment on the substrate. The stopper helps prevent any overflow of bonding materials, or undesired air gap formation. Its finish control-function can be adjusted via a touch screen display, providing the user with optimal positioning of the substrate before the bonding process begins. SBB-310 features a variety of safety features including an emergency stop mechanism that can be activated with an intuitive touch, and active and passive protection for the unit. It also has a built-in monitoring system, which is advantageous for ensuring optimal production conditions. In addition, its automatic off-cycle mode helps improve the performance of the unit and increase the machine's overall efficiency. This advanced bonder is designed to facilitate accurate chip placement and low-cost operation. Its intuitive user-interface and high-precision design make it an ideal choice for circuit board assembly and other bonding applications. With its precise operation and precision technology, SHINKAWA SBB-310 is an invaluable tool for those seeking a high-performance bonder.