Used SHINKAWA SBB-310 #9284113 for sale

SHINKAWA SBB-310 is a vacuum assist, full-size benchtop production bonder that is designed for efficient and accurate semiconductor wire bonding. It is a cost-effective solution for high-volume bonding of semiconductor packages, integrated circuits, and other substrates. SBB-310 features a specialized bonding head design and a precision-controlled wire feed equipment. This ensures that the bond head is securely held in place and the wire is fed through the bond pad accurately and reliably. SHINKAWA SBB-310 also utilizes a vacuum-assist system to ensure precise placement of the wire on the bond pad. SBB-310 is capable of performing both thermocompression and thermosonic gold ball bonding. It has a temperature range of 150 to 450 degrees Celsius and a gap range of 0.5 to 4 millimeters. SHINKAWA SBB-310 also features an intuitive, user-friendly interface with graphic navigation that allows for easy programming and operation. SBB-310 has a small form factor making it suitable for production line environments and compatible with standard ESD requirements. It features a quick-release bond head design making it convenient for fast setup and maintenance. SHINKAWA SBB-310 is designed with a high-speed bonding capability that offers superior process yield in production environments. It has a direct-drive wire feed unit with precise speed and tension control to ensure controlled wire tension and precise bond formation. SBB-310 also features a dual-level wire feed control machine that enables programming of both the speed and wire tension levels. This feature provides maximum process control and yields consistent results. SHINKAWA SBB-310 is a reliable and cost-effective solution for high-volume production wire bonding. It is designed with user-friendly operation and precise bonding capabilities to ensure accurate and consistent results. This benchtop production bonder is an ideal solution for production environments.