Used SHINKAWA SBB-410 #9050366 for sale

Manufacturer
SHINKAWA
Model
SBB-410
ID: 9050366
Vintage: 2002
Bump bonder Non-operational 2002 vintage.
SHINKAWA SBB-410 Bonder is a fully automated thermosonic bonding platform designed to support rapid development of products for the automotive, industrial and consumer industries. It utilizes a patented laser pitch change technology to provide flexible, high-accuracy bonding of thermoplastics, metals and ceramics within seconds. SBB-410 Bonder has a flexible pitch selection range from 0° to 6° and can bond wire in either the radial or axial directions for a range of applications. It also offers a high-yield bond rates which facilitates a rapid throughput. SHINKAWA SBB-410 Bonder utilizes a high-torque motor to precisely bond in wire sizes ranging from 0.03mm to 0.25mm in diameter. The thermosonic wire bond process is controlled through the intuitive, highly graphical 7" color user interface. Through the Control Panel interface, users can easily adjust wire type, pitch, bond speed, bond time, oscillation frequency, bond force and temperature. All parameter settings are monitored and recorded to ensure consistent, repeatable results. SBB-410 Bonder features an extendable arm design that facilitates quick and easy loading and unloading of bond heads, even when working with larger components. It is available in a 19" rack-mounted version that can easily be integrated into any production setting. SHINKAWA SBB-410 also offers an optional spooling equipment and pre-programmable recipes for wire and parameters that automate the wire bonding process. SBB-410 Bonder is equipped with a Safety Detection Function (SDF) that is designed to detect any change in wire location during the bonding process. The system can automatically check and adjust wire pitch for accuracy and consistency, ensuring consistent bonds every time. The advanced capacitor monitoring unit continuously checks for correct operation of the glue dispensing, over-temperature protection, bonding force and laser alignment systems. The SDF also helps minimize the risk of product damage, reduce the possibility of rework and ensure a successful bond. SHINKAWA SBB-410 Bonder is an ideal solution for manufacturers who require fast bonding and flexible pitch change for their products. It offers reliable bonding performance and can be integrated into any production setting to quickly and consistently bond thermoplastics, metals, and ceramics. With its integrated Safety Detection Machine providing accurate, repeatable results, SBB-410 Bonder is an ideal choice for any environment requiring efficient and precise wire bonding.
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