Used SHINKAWA SBB-410 #9050377 for sale

SHINKAWA SBB-410 is a wire bonder that is used for forming wire bonds in the production of electronic components. The unit is designed for use in both automatic and manual location applications. SBB-410 is capable of forming both ball and wedge bonds. It is fully programmable, allowing users to easily and accurately adjust parameters such as bond force, bond time, wire feed speed, and wire diameter. The unit is built with a microprocessor-controlled hot bar for reliable and repeatable bonding. Additionally, the wire feed assembly is designed to provide precise wire feeding and tension for consistent operation. SHINKAWA SBB-410 features an integrated microscope system and automatic bond length measurement system. These features improve quality control and reduce defects. The unit is also designed to be compatible with various parts feeders, enabling a fully automated production process. The unit is constructed from high-quality materials, which allows for a long service life and reliable performance. The unit is compact and easy to transport, making it a great choice for applications requiring portability. SBB-410 is ideal for producing high quality wire bonds in electronic components. With its programmability, integrated microscope and automatic bond length measurement, this unit is able to deliver consistent and reliable performance. The unit is suitable for both manual and automated production processes, and its compact size makes this bonder suitable for a wide range of applications.