Used SHINKAWA SBB-410 #9258239 for sale

SHINKAWA SBB-410 is a fully automated wire bonder for semiconductor devices. This machine is used to connect wire bonds between the inner electrodes of a device and its external metallic housing. The device is one of the most popular bonders in the industry due to its powerful performance and reliability. SBB-410 is equipped with several advanced features such as an intuitive motion control equipment, a highly accurate wire positioning system, and a precision control unit to ensure reliable and repeatable wire bonding processes. This machine is engineered for high-volume production of semiconductor devices, and it can handle various types of materials, from aluminum to gold. The bonder also features a unique bonding head design which can attach both axial and radial type bonds, depending on the application requirement. SHINKAWA SBB-410 has a variety of safety features, such as an environmental protection filter to reduce dust and smoke, and a laser safety filter for improved operator safety. The machine also offers an automatic calibration machine, which provides constant monitoring of the bonding process to ensure optimal bonding parameters. It also features a wide variety of advanced operations and process parameters that can be adjusted to meet the requirements of different semiconductor device types. The machine can be integrated with other external equipment such as printers and other automated equipment, making it an ideal choice for many applications in the semiconductor industry. Furthermore, SBB-410 can be connected to a personal computer to enable its monitoring and control. Overall, SHINKAWA SBB-410 is an excellent choice for high-volume production and is suitable for a wide range of semiconductor devices. Thanks to its reliable performance, intuitive user interface, and advanced safety features, the bonder is an excellent solution for many different applications in the semiconductor industry.