Used SHINKAWA SFB-200 #293587808 for sale

SHINKAWA SFB-200 is a state-of-the-art wire bonder designed to meet the highest levels of precision and accuracy. This advanced piece of technology is suitable for use in a wide range of applications, including semiconductor and automotive component assembly, circuit board assembly, and other highly sensitive electronics production processes. SHINKAWA SFB 200 is equipped with a high-resolution camera, enabling precise and reliable high-speed bonding under a variety of conditions. This machine can be used for both manual and automated wire bonding processes, utilizing various wire materials, including copper and gold, as well as more exotic materials such as nichrome. SFB-200 offers dynamic control of the wire feed speed, allowing for faster and more precise bonding with minimum heat transfer. In addition, the integrated temperature and pressure controllers ensure precise temperature and pressure management, allowing for consistent and reproducible bonds. It is also equipped with high-end vision systems and multi-axial handling capabilities. This ensures precise vision focusing and programmable wire positioning, allowing for precise and repeatable performance. Furthermore, SFB 200 has a programmable bond force mechanism, with a maximum bond force of 60N. This allows for multiple bonding processes, as well as an increased bond strength, making it an ideal choice for production environments. SHINKAWA SFB-200 is a highly precise and robust bonder, capable of meeting the highest standards of accuracy and reliability. Equipped with advanced vision systems and multi-axial handling capabilities, SHINKAWA SFB 200 can help deliver consistent and repeatable performance in even the most demanding production environments. Thanks to its reliable bond force and temperature and pressure management, it is the ideal choice for automated and manual wire bonding processes, making it a valuable asset in any electronics production.