Used SHINKAWA SWB-FA-US-30 #9077538 for sale
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ID: 9077538
Mobile Wedge Wire Bonding Machines
Operational Hitachi VM-920-S5 Monitor
Operational Luminar Ace LA-100T Illuminator
Unit powers on
Wheels
Alarm
Not working:
Semi operational indicator lights
Unresponsive controls
Non operational system.
SHINKAWA SWB-FA-US-30 is a state-of-the-art precision bonder designed to meet the needs of highly specialized applications. It is a wire bonder suitable for Al/Cu wire bonding of packages, which includes Ball, Wedge, and ribbon bonding for flexible and rigid substrates. SWB-FA-US-30 offers high resolution, high adhesion, and high efficiency wire bonding. SHINKAWA SWB-FA-US-30 is equipped with a high-precision X/Y/Z stage that allows for accurate, low-stiction movement. This ensures accuracy and repeatability in substrate positioning. The stage also has an anti-vibration feature for ensuring vibration-free operation. The bonder is connected to a standard PC for programming, and the built-in software allows users to manage and control the entire process. SWB-FA-US-30 features an industry-leading laser attachment equipment that provide precise wire loop heights and shapes. This system is adjustable for different substrates, which makes it ideal for complex applications that require bonding on small or irregular surfaces. Additionally, the bonder can also be used for soldering applications by utilizing a low-temperature soldering unit. SHINKAWA SWB-FA-US-30 also comes with a wide range of advanced process controls. The bonder features temperature control, protective gas injection, over-current sensing, and automatic wire length stopping. These features allow for increased precision in the wire bonding process, as well as enhanced safety and protection. SWB-FA-US-30 is highly reliable and boasts a long life-span. The bonder is protected by an electrolyte coat, which provides good corrosion protection and prevents short circuits. Additionally, the machine is equipped with a highly sensitive thermocouple for accurate temperature control. Overall, SHINKAWA SWB-FA-US-30 is a high-performance wire bonder that is designed for use in specialized applications. It features a high-precision X/Y/Z stage, industry-leading laser attachment machine, and advanced process controls. These features ensure SWB-FA-US-30 processes wire bonds with exceptional accuracy and repeatability. Furthermore, the long life-span and corrosion protection make it highly reliable and suitable for a range of different applications.
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