Used SHINKAWA US-30 #62074 for sale

SHINKAWA US-30 is a high-performance bonder specially designed for handling and processing small delicate electronic components. It offers superior bonding and bonding efficiency even under extreme challenges, such as temperatures as low as 0 °C or high temperatures as high as 1000 °C. US-30 features a two-phase process: a hot-pressing stage and a laser welding stage. It is equipped with an integrated, high-resolution CCD camera that optimizes monitor and accuracy for each component. The camera captures the component's image, allowing for the inspection of component size, shape, etc. SHINKAWA US-30's hot-pressing stage combines high accuracy and small mounting area to conduct a wide range of operations. Its high-speed piezo actuator delivers precise force control, while its high-frequency vibration equipment ensures improved stability and repeatability. During this stage, hot pressing can be done in two steps: shaping and bonding. The laser welding stage utilizes real-time monitoring to ensure consistent welding performance. US-30 is designed with an automated alignment system that can exactly track components for fine-tuned results. In order to guarantee gentle and uniform heating, SHINKAWA US-30's cooling unit consists of a highly efficient fin cooling machine and high-precision temperature control. Combined with its low thermal influence, this helps to realize high bonding with uniform heating. Overall, US-30 is the perfect instrument for manufacturers looking to bond small, delicate components accurately and efficiently. With its integrated CCD camera, high-pressure and laser-welding capabilities, high-resolution sensors and automated alignment tool, this is the perfect bonding machine to take your business to the next level.