Used SHINKAWA UTC-100 #9312377 for sale

SHINKAWA UTC-100 is an advanced automatic bonding machine that is designed for precise bonding applications on small-scale parts such as those encountered in portable electronics, consumer electronics, and automotive applications. It has the capability to join two surfaces together at temperatures lower than 250˚C while using a combination of thermal energy and ultrasonic vibration to produce strong, permanent bonds. UTC-100's ultrasonic energy creates microscopic gaps in a material to create molecular-level interactions between the two bonded surfaces, creating a strong bond known as a "sonobond". SHINKAWA UTC-100 has a small footprint, allowing it to fit into small spaces and function in tight work areas. It is also robust, being able to withstand harsh environments and temperatures that can exceed 200°C. The machine is designed with a high degree of accuracy, allowing it to achieve the same bond strength and temperature every time. With its high bond speed and maximum output of 3.5kW, UTC-100 is capable of bonding large components quickly and efficiently. SHINKAWA UTC-100 also has user-friendly features such as its dual manipulator arm design, allowing the machine to move in near perfect harmony with the operator. And with an integrated intelligent monitoring system, the operator is always in full control of the bonding process. Furthermore, the machine's four-panel LCD touchscreen display, allows for a fast and easy setup and calibration procedure, reducing time and energy consumption significantly. UTC-100 is an energy-efficient machine, running on a single-phase AC power source. This efficiency allows for significant savings in energy costs, while providing a safe and effective alternative to traditional methods of bonding. Finally, SHINKAWA UTC-100 comes with a range of accessories such as talon shaped horns, and flexible jigs and fixtures, allowing it to be used for a variety of applications. With all these attributes, UTC-100 is an ideal machine for bonders.