Used SHINKAWA UTC-1000 Super #293604621 for sale

SHINKAWA UTC-1000 Super bonder is a fully automated state-of-the-art bonding machine designed for high performance, precise, and accurate bonding for a wide array of substrates. The machine is capable of working on substrates of any size and thickness, and is ideal for use in the production of consumer electronics and other products that require a precise and uniform bond. The machine features a powerful onboard computer that runs a precise, advanced algorithm to ensure precise, repeatable bonding results. SHINKAWA UTC-1000SUPER bonder is equipped with a high frequency output generator with adjustment from 10 kHz to 2000kHz, allowing users to customize the strength of the bond for a variety of substrates. The machine can be operated with either manual or automatic control for consistently high-quality bonding results. An easy-to-use LCD touch panel simplifies user interface and allows for quick setup and operation. The bonder incorporates a unique bonding head technology which features a heated, vibration-controlled head that precisely tracks along a pathway, eliminating any head drift. The heated head ensures uniform and reliable bonding, while the vibration control eliminates any potential problems of vibrations in the bond area. Additionally, a feedback system measures the pressure, temperature, and bond speed, and provides feedback to the operator to ensure accuracy and repeatability. UTC 1000 SUPER bonder is capable of both "Hot Stick Bonding" (HSB) and "Foam Bonds" (F-bonds). HSB is a process that utilizes hot air to encourage the adhesion of the substrate materials as the adhesive solidifies. Foam Bonds are formed by filling a space between two materials with a foaming bonding agent. This process is useful for creating an airtight seal between the substrate materials, as well as providing a sound insulation barrier. The powerful UTC-1000 Super bonder is able to bond substrates of any size or thickness and offers the user high versatility. With its advanced bonding head, precise feedback system, and easy to use LCD touch panel, this machine is ideal for any task that requires accurate and consistent bonding results.